08872318 cites 149 patents.

A microelectronic package includes a subassembly, a second substrate, and a monolithic encapsulant. The subassembly includes a first substrate that has at least one aperture, a coefficient of thermal expansion (CTE) of eight parts per million per degree Celsius or less, and first and second contacts arranged so as to have a pitch of 200 microns or less. First and second microelectronic elements are respectively electrically connected to the first and second contacts. Wire bonds may be used to connect the second element contacts with the second contacts. A second substrate may underlie either the first or the second microelectronic elements and be electrically interconnected with the first substrate. The second substrate may have terminals configured for electrical connection to a component external to the microelectronic package. A monolithic encapsulant may contact the first and second microelectronic elements and the first and second substrates.

Title
Through interposer wire bond using low CTE interposer with coarse slot apertures
Application Number
13/216465
Publication Number
8872318 (B2)
Application Date
August 24, 2011
Publication Date
October 28, 2014
Inventor
Belgacem Haba
Saratoga
CA, US
Wael Zohni
San Jose
CA, US
Simon McElrea
San Jose
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H01L 23/00
H01L 23/13
H01L 25/065
H01L 21/48
H01L 23/498
H01L 29/40
H01L 23/48
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