08866300 is referenced by 4 patents and cites 178 patents.

Structures, materials, and methods to control the spread of a solder material or other flowable conductive material in electronic and/or electromagnetic devices are provided.

Title
Devices and methods for solder flow control in three-dimensional microstructures
Application Number
13/488991
Publication Number
8866300 (B1)
Application Date
June 5, 2012
Publication Date
October 21, 2014
Inventor
James R Reid Jr
Billerica
MA, US
David W Sherrer
Radford
VA, US
Agent
Dann Dorfman Herrell & Skillman PC
Niels Haun
Assignee
Nuvotronics
VA, US
IPC
H02G 15/00
H01L 23/48
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