08829671 is referenced by 38 patents and cites 258 patents.

An electrical interconnect between terminals on an IC device and contact pads on a printed circuit board (PCB). The electrical interconnect includes a substrate with a first surface having a plurality of openings arranged to correspond to the terminals on the IC device. A compliant material is located in the openings. A plurality of first conductive traces extend along the first surface of the substrate and onto the compliant material. The compliant material provides a biasing force that resists flexure of the first conductive traces into the openings. Vias extending through the substrate are electrically coupled the first conductive traces. A plurality of second conductive traces extend along the second surface of the substrate and are electrically coupled to a vias. The second conductive traces are configured to electrical couple with the contact pads on the PCB.

Title
Compliant core peripheral lead semiconductor socket
Application Number
14/58863
Publication Number
8829671 (B2)
Application Date
October 21, 2013
Publication Date
September 9, 2014
Inventor
James Rathburn
Maple Grove
MN, US
Agent
Stoel Rives
Assignee
Hsio Technologies
MN, US
IPC
H01L 23/34
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