08789272 is referenced by 37 patents and cites 321 patents.

A test socket that provides a temporary interconnect between terminals on an integrated circuit (IC) device and contact pads on a test printed circuit board (PCB). The test socket includes a compliant printed circuit and a socket housing. The compliant printed circuit includes at least one compliant layer, a plurality of first contact members located along a first major surface, a plurality of second contact members located along a second major surface, and a plurality of conductive traces electrically coupling the first and second contact members. The compliant layer is positioned to bias the first contact members against the terminals on the IC device and the second contact members against contact pads on the test PCB. The socket housing is coupled to the compliant printed circuit so the first contact members are positioned in a recess of the socket housing sized to receive the IC device.

Title
Method of making a compliant printed circuit peripheral lead semiconductor test socket
Application Number
13/318171
Publication Number
8789272 (B2)
Application Date
May 27, 2010
Publication Date
July 29, 2014
Inventor
James Rathburn
Mound
MN, US
Agent
Stoel Rives
Assignee
HSIO Technologies
MN, US
IPC
H05K 3/10
H05K 3/02
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