08779574 is referenced by 73 patents and cites 36 patents.

A semiconductor die that includes a plurality of non-metallic slots that extend through a current routing line is disclosed. The semiconductor die comprises a semiconductor circuit that includes a plurality of semiconductor components and a current trace line that is coupled to a first semiconductor component. Further, the semiconductor die comprises a current routing line that is coupled with the current trace line. The current routing line includes a plurality of non-metallic slots that extend through the current routing line.

Title
Semiconductor die including a current routing line having non-metallic slots
Application Number
13/854898
Publication Number
8779574 (B1)
Application Date
April 1, 2013
Publication Date
July 15, 2014
Inventor
Mingying Gu
Aliso Viejo
CA, US
John R Agness
Laguna Hills
CA, US
Assignee
Western Digital Technologies
CA, US
IPC
H01L 23/52
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