08728865 is referenced by 54 patents and cites 399 patents.

A method of making a microelectronic assembly can include molding a dielectric material around at least two conductive elements which project above a height of a substrate having a microelectronic element mounted thereon, so that remote surfaces of the conductive elements remain accessible and exposed within openings extending from an exterior surface of the molded dielectric material. The remote surfaces can be disposed at heights from said surface of said substrate which are lower or higher than a height of the exterior surface of the molded dielectric material from the substrate surface. The conductive elements can be arranged to simultaneously carry first and second different electric potentials: e.g., power, ground or signal potentials.

Title
Microelectronic packages and methods therefor
Application Number
13/12949
Publication Number
8728865 (B2)
Application Date
January 25, 2011
Publication Date
May 20, 2014
Inventor
Ellis Chau
San Jose
CA, US
Ilyas Mohammed
Santa Clara
CA, US
Teck Gyu Kang
San Jose
CA, US
Belgacem Haba
Saratoga
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H01L 21/00
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