08659164 is referenced by 54 patents and cites 418 patents.

A package for a microelectronic element, such as a semiconductor chip, has a dielectric mass overlying the package substrate and microelectronic element and has top terminals exposed at the top surface of the dielectric mass. Traces extending along edge surfaces of the dielectric mass desirably connect the top terminals to bottom terminals on the package substrate. The dielectric mass can be formed, for example, by molding or by application of a conformal layer.

Title
Microelectronic package with terminals on dielectric mass
Application Number
13/648495
Publication Number
8659164 (B2)
Application Date
October 10, 2012
Publication Date
February 25, 2014
Inventor
Belgacem Haba
Saratoga
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H01K 1/18
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