08641913 is referenced by 9 patents and cites 208 patents.

A method includes applying a final etch-resistant material to an in-process substrate so that the final etch-resistant material at least partially covers first microcontact portions integral with the substrate and projecting upwardly from a surface of the substrate, and etching the surface of the substrate so as to leave second microcontact portions below the first microcontact portions and integral therewith, the final etch-resistant material at least partially protecting the first microcontact portions from etching during the further etching step. A microelectronic unit includes a substrate, and a plurality of microcontacts projecting in a vertical direction from the substrate, each microcontact including a base region adjacent the substrate and a tip region remote from the substrate, each microcontact having a horizontal dimension which is a first function of vertical location in the base region and which is a second function of vertical location in the tip region.

Title
Fine pitch microcontacts and method for forming thereof
Application Number
11/717587
Publication Number
8641913 (B2)
Application Date
March 13, 2007
Publication Date
February 4, 2014
Inventor
Jae M Park
San Jose
CA, US
Teck Gyu Kang
San Jose
CA, US
Yoichi Kubota
San Jose
CA, US
Belgacem Haba
San Jose
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H01L 21/302
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