08637991 is referenced by 15 patents and cites 417 patents.

A package for a microelectronic element, such as a semiconductor chip, has a dielectric mass overlying the package substrate and microelectronic element and has top terminals exposed at the top surface of the dielectric mass. Traces extending along edge surfaces of the dielectric mass desirably connect the top terminals to bottom terminals on the package substrate. The dielectric mass can be formed, for example, by molding or by application of a conformal layer.

Title
Microelectronic package with terminals on dielectric mass
Application Number
13/295608
Publication Number
8637991 (B2)
Application Date
November 14, 2011
Publication Date
January 28, 2014
Inventor
Belgacem Haba
Saratoga
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H01L 23/48
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