08637968 is referenced by 2 patents and cites 250 patents.

A microelectronic assembly can include first and second microelectronic elements each embodying active semiconductor devices adjacent a front surface thereof, and having an electrically conductive pad exposed at the respective front surface. An interposer of material having a CTE less than 10 ppm/° C. has first and second surfaces attached to the front surfaces of the respective first and second microelectronic elements, the interposer having a second conductive element extending within an opening in the interposer. First and second conductive elements extend within openings extending from the rear surface of a respective microelectronic element of the first and second microelectronic elements towards the front surface of the respective microelectronic element. In one example, one or more of the first or second conductive elements extends through the respective first or second pad, and the conductive elements contact the exposed portions of the second conductive element to provide electrical connection therewith.

Title
Stacked microelectronic assembly having interposer connecting active chips
Application Number
12/958866
Publication Number
8637968 (B2)
Application Date
December 2, 2010
Publication Date
January 28, 2014
Inventor
Craig Mitchell
San Jose
CA, US
Piyush Savalia
Santa Clara
CA, US
Ilyas Mohammed
Santa Clara
CA, US
Vage Oganesian
Palo Alto
CA, US
Belgacem Haba
Saratoga
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H01L 29/40
H01L 23/02
H01L 23/48
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