08623706 is referenced by 1 patents and cites 417 patents.

A package for a microelectronic element 48, such as a semiconductor chip, has a dielectric mass 86 overlying the package substrate 56 and microelectronic element 48 and has top terminals 38 exposed at the top surface 94 of the dielectric mass 86. Traces 36a, 36b extending along edge surfaces 96, 108 of the dielectric mass 86 desirably connect the top terminals 38 to bottom terminals 64 on the package substrate 56. The dielectric mass 86 can be formed, for example, by molding or by application of a conformal layer 505.

Title
Microelectronic package with terminals on dielectric mass
Application Number
13/637185
Publication Number
8623706 (B2)
Application Date
November 14, 2011
Publication Date
January 7, 2014
Inventor
Belgacem Haba
Saratoga
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H01L 21/44
H01L 21/00
View Original Source