08618659 is referenced by 70 patents and cites 268 patents.

A microelectronic assembly includes a substrate having a first surface and a second surface remote from the first surface. A microelectronic element overlies the first surface and first electrically conductive elements are exposed at one of the first surface and the second surface. Some of the first conductive elements are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the substrate and the bases, each wire bond defining an edge surface extending between the base and the end surface. An encapsulation layer extends from the first surface and fills spaces between the wire bonds such that the wire bonds are separated by the encapsulation layer. Unencapsulated portions of the wire bonds are defined by at least portions of the end surfaces of the wire bonds that are uncovered by the encapsulation layer.

Title
Package-on-package assembly with wire bonds to encapsulation surface
Application Number
13/462158
Publication Number
8618659 (B2)
Application Date
May 2, 2012
Publication Date
December 31, 2013
Inventor
Tomoyuki Kikuchi
Tokyo
JP
Kurosawa Inetaro
Saitma
JP
Kiyoaki Hashimoto
Kanagawa
JP
Kazuo Sakuma
Iwaki
JP
Norihito Masuda
Kanagawa
JP
Ilyas Mohammed
San Jose
CA, US
Ellis Chau
San Jose
CA, US
Wei Shun Wang
Palo Alto
CA, US
Philip R Osborn
San Jose
CA, US
Belgacem Haba
San Jose
CA, US
Teck Gyu Kang
San Jose
CA, US
Hiroaki Sato
Kanagawa
JP
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H01L 23/48
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