08610265 is referenced by 43 patents and cites 249 patents.

An electrical interconnect for providing a temporary interconnect between terminals on an IC device and contact pads on a printed circuit board (PCB). The electrical interconnect includes a substrate with a first surface having a plurality of openings arranged to correspond to the terminals on the IC device. A compliant material is located in the openings. A plurality of conductive traces extend along the first surface of the substrate and onto the compliant material. The compliant material provides a biasing force that resists flexure of the conductive traces into the openings. Conductive structures are electrically coupled to the conductive traces over the openings. The conductive structures are adapted to enhance electrical coupling with the terminals on the IC device. Vias electrically extending through the substrate couple the conductive traces to PCB terminals located proximate a second surface of the substrate.

Title
Compliant core peripheral lead semiconductor test socket
Application Number
13/448865
Publication Number
8610265 (B2)
Application Date
April 17, 2012
Publication Date
December 17, 2013
Inventor
James Rathburn
Mound
MN, US
Agent
Stoel Rives
Assignee
Hsio Technologies
MN, US
IPC
H01L 23/34
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