08598695 is referenced by 24 patents and cites 42 patents.

A structure including a first semiconductor chip with front and rear surfaces and a cavity in the rear surface. A second semiconductor chip is mounted within the cavity. The first chip may have vias extending from the cavity to the front surface and via conductors within these vias serving to connect the additional microelectronic element to the active elements of the first chip. The structure may have a volume comparable to that of the first chip alone and yet provide the functionality of a multi-chip assembly. A composite chip incorporating a body and a layer of semiconductor material mounted on a front surface of the body similarly may have a cavity extending into the body from the rear surface and may have an additional microelectronic element mounted in such cavity.

Title
Active chip on carrier or laminated chip having microelectronic element embedded therein
Application Number
12/842692
Publication Number
8598695 (B2)
Application Date
July 23, 2010
Publication Date
December 3, 2013
Inventor
Piyush Savalia
San Jose
CA, US
Belgacem Haba
Saratoga
CA, US
Craig Mitchell
San Jose
CA, US
Ilyas Mohammed
Santa Clara
CA, US
Vage Oganesian
Palo Alto
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H01L 23/02
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