08597539 cites 5 patents.

This invention relates to a chemical composition for chemical mechanical polishing (CMP) of substrates that are widely used in the semiconductor industry. The inventive chemical composition contains additives that are capable of improving consistency of the polishing performance and extending the lifetime of a polishing pad.

Title
Chemical mechanical polishing (CMP) polishing solution with enhanced performance
Application Number
13/122496
Publication Number
8597539 (B2)
Application Date
September 29, 2009
Publication Date
December 3, 2013
Inventor
Shyam S Venkataraman
Potsdam
NY, US
Harvey Wayne Pinder
Potsdam
NY, US
Yuzhuo Li
Heidelberg
DE
Agent
Oblon Spivak McClelland Maier & Neustadt L
Assignee
BASF SE
DE
IPC
C09K 13/06
View Original Source