08525346 is referenced by 46 patents and cites 230 patents.

An electrical interconnect providing an interconnect between contacts on an IC device and contact pads on a printed circuit board (PCB). The electrical interconnect includes a substrate with a plurality of through holes extending from a first surface to a second surface. A resilient material is located in the through holes. The resilient material includes an opening extending from the first surface to the second surface. A plurality of discrete, free-flowing conductive nano-particles are located in the openings of the resilient material. The conductive particles are substantially free of non-conductive materials. A plurality of first contact members are located in the through holes adjacent the first surface and a plurality of second contact members are located in the through holes adjacent the second surface. The first and second contact members are electrically coupled to the nano-particles.

Title
Compliant conductive nano-particle electrical interconnect
Application Number
13/448914
Publication Number
8525346 (B2)
Application Date
April 17, 2012
Publication Date
September 3, 2013
Inventor
James Rathburn
Mound
MN, US
Agent
Stoel Rives
Assignee
HSIO Technologies
MN, US
IPC
H01L 23/48
View Original Source