08525338 is referenced by 1 patents and cites 12 patents.

A microelectronic package and method of making same are provided. The package includes a substrate having first and second opposed surfaces, an edge surface extending therebetween, a plurality of terminals, and a plurality of conductive elements electrically connected with the terminals. The edge surface can be disposed at a periphery of the substrate or can be the edge surface of an aperture within the substrate. A microelectronic element has a front face and contacts thereon, with at least some of the contacts being adjacent to the edge surface of the substrate. A dielectric material overlies the edge surface of the substrate and defines a sloping surface between the front face of the microelectronic element and the substrate. A conductive matrix material defines a plurality of conductive interconnects extending along the sloping surface. The conductive interconnects electrically interconnect respective ones of the contacts with the conductive elements.

Title
Chip with sintered connections to package
Application Number
13/154778
Publication Number
8525338 (B2)
Application Date
June 7, 2011
Publication Date
September 3, 2013
Inventor
Philip Damberg
Cupertino
CA, US
Ilyas Mohammed
Santa Clara
CA, US
Belgacem Haba
Saratoga
CA, US
Norihito Masuda
Yokohama
JP
Yoshikuni Nakadaira
Hodogaya-Ku
JP
Kiyoaki Hashimoto
Yokohama
JP
Hiroaki Sato
Yokohama
JP
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H01L 21/00
H01L 29/40
H01L 23/52
H01L 23/48
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