08525318 is referenced by 93 patents and cites 181 patents.

Disclosed are a semiconductor device capable of efficiently radiating heat of a semiconductor die and a method of fabricating the same. The semiconductor device efficiently radiates the heat by preventing an encapsulant from reaching the semiconductor die by an encapsulant dam so that an upper surface of the semiconductor die is exposed out of the encapsulant. In addition, the semiconductor device is configured to expose a pre-solder ball or a conductive pattern of a substrate through a via of the encapsulant. Therefore, electrical connection between the pre-solder ball and a solder ball of another semiconductor device stacked thereon is easily achieved.

Title
Semiconductor device and fabricating method thereof
Application Number
12/943540
Publication Number
8525318 (B1)
Application Date
November 10, 2010
Publication Date
September 3, 2013
Inventor
Ye Sul Ahn
Seoul
KR
Kwang Ho Kim
Kyunggi-do
KR
Dong Joo Park
Incheon
KR
Jin Seong Kim
Seoul
KR
Agent
Serge J Hodgson
McKay and Hodgson
Assignee
Amkor Technology
AZ, US
IPC
H01L 23/02
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