08520222 is referenced by 4 patents and cites 2 patents.

A system for holding non-contact wafer probes over the surface of a wafer which includes a system for flushing the surface of the probe during grinding.

Title
System and method for in situ monitoring of top wafer thickness in a stack of wafers
Application Number
13/291800
Publication Number
8520222 (B2)
Application Date
November 8, 2011
Publication Date
August 27, 2013
Inventor
Benjamin C Smedley
San Luis Obispo
CA, US
Michael R Vogtmann
San Luis Obispo
CA, US
Frederic Anthony Schraub
San Luis Obispo
CA, US
Agent
Crockett & Crockett PC
K David Crockett Esq
Assignee
Strasbaugh
CA, US
IPC
G01B 11/28
View Original Source