08518304 is referenced by 3 patents and cites 252 patents.

The present invention features additions of nanostructures to interconnect conductor particles to: (1) reduce thermal interface resistance by using thermal interposers that have high thermal conductivity nanostructures at their surfaces; (2) improve the anisotropic conductive adhesive interconnection conductivity with microcircuit contact pads; and (3) allow lower compression forces to be applied during the microcircuit fabrication processes which then results in reduced deflection or circuit damage. When pressure is applied during fabrication to spread and compress anisotropic conductive adhesive and the matrix of interconnect particles and circuit conductors, the nano-structures mesh and compress into a more uniform connection than current technology provides, thereby eliminating voids, moisture and other contaminants, increasing the contact surfaces for better electrical and thermal conduction.

Title
Nano-structure enhancements for anisotropic conductive material and thermal interposers
Application Number
12/686236
Publication Number
8518304 (B1)
Application Date
January 12, 2010
Publication Date
August 27, 2013
Inventor
Ganesh Subbarayan
West Lafayette
IN, US
Wayne E Jones Jr
Vestal
NY, US
Bahgat Sammakia
Binghamton
NY, US
Agent
Ostrolenk Faber
Steven M Hoffberg
Assignee
The Research Foundation of State University of New York
NY, US
IPC
H05K 1/09
H01B 1/02
H01B 1/04
H01B 1/00
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