08513817 is referenced by 41 patents and cites 157 patents.

A microelectronic package can include a substrate having first and second opposed surfaces, first, second, third, and fourth microelectronic elements, and a plurality of terminals exposed at the second surface. Each microelectronic element can have a front surface facing the first surface of the substrate and a plurality of contacts at the front surface. The front surfaces of the microelectronic elements can be arranged in a single plane parallel to the first surface. Each microelectronic element can have a column of contacts exposed at the front surface and arranged along respective first, second, third, and fourth axes. The first and third axes can be parallel to one another. The second and fourth axes can be transverse to the first and third axes. The microelectronic package can also include electrical connections extending from at least some of the contacts of each microelectronic element to at least some of the terminals.

Title
Memory module in a package
Application Number
13/346201
Publication Number
8513817 (B2)
Application Date
January 9, 2012
Publication Date
August 20, 2013
Inventor
Ilyas Mohammed
San Jose
CA, US
Richard Dewitt Crisp
Hornitos
CA, US
Wael Zohni
San Jose
CA, US
Belgacem Haba
Saratoga
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Invensas Corporation
CA, US
IPC
H01L 23/52
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