08361842 is referenced by 134 patents and cites 2 patents.

A method includes providing a carrier with an adhesive layer disposed thereon; and providing a die including a first surface, a second surface opposite the first surface. The die further includes a plurality of bond pads adjacent the second surface; and a dielectric layer over the plurality of bond pads. The method further includes placing the die on the adhesive layer with the first surface facing toward the adhesive layer and dielectric layer facing away from the adhesive layer; forming a molding compound to cover the die, wherein the molding compound surrounds the die; removing a portion of the molding compound directly over the die to expose the dielectric layer; and forming a redistribution line above the molding compound and electrically coupled to one of the plurality of bond pads through the dielectric layer.

Title
Embedded wafer-level bonding approaches
Application Number
12/880736
Publication Number
8361842 (B2)
Application Date
September 13, 2010
Publication Date
January 29, 2013
Inventor
Jing Cheng Lin
Hsin-Chu
TW
Chen Hua Yu
Hsin-Chu
TW
Agent
Slater & Matsil L
Assignee
Taiwan Semiconductor Manufacturing Company
TW
IPC
H01L 21/50
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