08324646 is referenced by 246 patents and cites 9 patents.

A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.

Title
Chip coated light emitting diode package and manufacturing method thereof
Application Number
12/842493
Publication Number
8324646 (B2)
Application Date
July 23, 2010
Publication Date
December 4, 2012
Inventor
Seong Yeon Han
Gwangjoo
KR
Kyung Taeg Han
Gyunggi-Do
KR
Seon Goo Lee
Gyunggi-Do
KR
Agent
McDermott Will & Emery
Assignee
Samsung Electronics
KR
IPC
H01L 33/00
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