08310036 is referenced by 18 patents and cites 180 patents.

A microelectronic unit is provided in which front and rear surfaces of a semiconductor element may define a thin region which has a first thickness and a thicker region having a thickness at least about twice the first thickness. A semiconductor device may be present at the front surface, with a plurality of first conductive contacts at the front surface connected to the device. A plurality of conductive vias may extend from the rear surface through the thin region of the semiconductor element to the first conductive contacts. A plurality of second conductive contacts can be exposed at an exterior of the semiconductor element. A plurality of conductive traces may connect the second conductive contacts to the conductive vias.

Title
Chips having rear contacts connected by through vias to front contacts
Application Number
12/784841
Publication Number
8310036 (B2)
Application Date
May 21, 2010
Publication Date
November 13, 2012
Inventor
Vage Oganesian
Palo Alto
CA, US
David B Tuckerman
Lafayette
CA, US
Kenneth Allen Honer
Santa Clara
CA, US
Belgacem Haba
Saratoga
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
DigitalOptics Corporation Europe
IE
IPC
H01L 21/00
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