08298966 cites 11 patents.

Structures and methods for forming the same. A semiconductor chip includes a substrate and a transistor. The chip includes N interconnect layers on the substrate, N being a positive integer. The chip includes a cooling pipes system inside the N interconnect layers. The cooling pipes system does not include any solid or liquid material. Given any first point and any second point in the cooling pipes system, there exists a continuous path which connects the first and second points and which is totally within the cooling pipes system. A first portion of the cooling pipes system overlaps the transistor. A second portion of the cooling pipes system is higher than the substrate and lower than a top interconnect layer. The second portion is in direct physical contact with a surrounding ambient.

Title
On-chip cooling systems for integrated circuits
Application Number
12/698370
Publication Number
8298966 (B2)
Application Date
February 2, 2010
Publication Date
October 30, 2012
Inventor
Richard Stephen Wise
Newburgh
NY, US
Michael Ray Sievers
Poughkeepsie
NY, US
Andres Fernando Munoz
Yonkers
NY, US
Kaushik A Kumar
Beacon
NY, US
Agent
Joseph Abate
Schmeiser Olsen & Watts
Assignee
International Business Machines Corporation
NY, US
IPC
H01L 21/26
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