08278746 is referenced by 72 patents and cites 278 patents.

Described herein are wafer-level semiconductor device packages with stacking functionality and related stacked package assemblies and methods. In one embodiment, a semiconductor device package includes a set of connecting elements disposed adjacent to a periphery of a set of stacked semiconductor devices. At least one of the connecting elements is wire-bonded to an active surface of an upper one of the stacked semiconductor devices.

Title
Semiconductor device packages including connecting elements
Application Number
12/753837
Publication Number
8278746 (B2)
Application Date
April 2, 2010
Publication Date
October 2, 2012
Inventor
Chia Ching Chen
Kaohsiung
TW
Yi Chuan Ding
Kaohsiung
TW
Agent
Foley & Lardner
Assignee
Advanced Semiconductor Engineering
TW
IPC
H01L 23/48
H01L 21/70
H01L 23/52
H01L 25/065
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