08230593 is referenced by 14 patents and cites 244 patents.

In assembly of probe arrays for electrical test, a problem can arise where a bonding agent undesirably wicks between probes. According to embodiments of the invention, this wicking problem is alleviated by disposing an anti-wicking agent on a surface of the probe assembly such that wicking of the bonding agent along the probes toward the probe tips is hindered. The anti-wicking agent can be a solid powder, a liquid, or a gel. Once probe assembly fabrication is complete, the anti-wicking agent is removed. In preferred embodiments, a template plate is employed to hold the probe tips in proper position during fabrication. In this manner, undesirable bending of probes caused by introduction or removal of the anti-wicking agent can be reduced or eliminated.

Title
Probe bonding method having improved control of bonding material
Application Number
12/156131
Publication Number
8230593 (B2)
Application Date
May 29, 2008
Publication Date
July 31, 2012
Inventor
January Kister
Portola Valley
CA, US
Agent
Peacock Myers P C
Samantha A Updegraff
Deborah A Peacock
Assignee
MicroProbe
CA, US
IPC
H01R 43/00
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