08207604 is referenced by 52 patents and cites 79 patents.

A microelectronic package includes a mounting structure, a microelectronic element associated with the mounting structure, and a plurality of conductive posts physically connected to the mounting structure and electrically connected to the microelectronic element. The conductive posts project from the mounting structure in an upward direction, at least one of the conductive posts being an offset post. Each offset post has a base connected to the mounting structure, the base of each offset post defining a centroid. Each offset post also defines an upper extremity having a centroid, the centroid of the upper extremity being offset from the centroid of the base in a horizontal offset direction transverse to the upward direction. The mounting structure is adapted to permit tilting of each offset post about a horizontal axis so that the upper extremities may wipe across a contact pad of an opposing circuit board.

Title
Microelectronic package comprising offset conductive posts on compliant layer
Application Number
10/985126
Publication Number
8207604 (B2)
Application Date
November 10, 2004
Publication Date
June 26, 2012
Inventor
Jae M Park
San Jose
CA, US
Giles Humpston
San Jose
CA, US
Masud Beroz
Livermore
CA, US
Belgacem Haba
Cupertino
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H01L 23/485
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