08203207 is referenced by 37 patents and cites 32 patents.

Provided are electronic device packages and their methods of formation. The electronic device packages include an electronic device mounted on a substrate, a conductive via and a locally thinned region in the substrate. The invention finds application, for example, in the electronics industry for hermetic packages containing an electronic device such as an IC, optoelectronic or MEMS device.

Title
Electronic device packages and methods of formation
Application Number
12/72157
Publication Number
8203207 (B2)
Application Date
February 25, 2008
Publication Date
June 19, 2012
Inventor
John J Fisher
Taylors
SC, US
David W Sherrer
Radford
VA, US
James W Getz
Blacksburg
VA, US
Agent
Sughrue Mion PLLC
Assignee
Samsung Electronics
KR
IPC
H01L 21/302
H01L 21/44
H01L 21/4763
H01L 29/40
H01L 29/06
H01L 23/04
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