08193615 is referenced by 32 patents and cites 89 patents.

A microelectronic unit 400 can include a semiconductor element 401 having a front surface, a microelectronic semiconductor device adjacent to the front surface, contacts 403 at the front surface and a rear surface remote from the front surface. The semiconductor element 401 can have through holes 410 extending from the rear surface through the semiconductor element 401 and through the contacts 403. A dielectric layer 411 can line the through holes 410. A conductive layer 412 may overlie the dielectric layer 411 within the through holes 410. The conductive layer 412 can conductively interconnect the contacts 403 with unit contacts.

Title
Semiconductor packaging process using through silicon vias
Application Number
12/221204
Publication Number
8193615 (B2)
Application Date
July 31, 2008
Publication Date
June 5, 2012
Inventor
Moti Margalit
Zichron
IL
Giles Humpston
Buckinghamshire
GB
Belgacem Haba
Saratoga
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
DigitalOptics Corporation Europe
IE
IPC
H01L 23/485
View Original Source