08183696 is referenced by 25 patents and cites 5 patents.

A semiconductor package includes a semiconductor chip, an encapsulant embedding the semiconductor chip, first contact pads on a first main face of the semiconductor package and second contact pads on a second main face of the semiconductor package opposite to the first main face. The diameter d in micrometers of an exposed contact pad area of the second contact pads satisfies d≧(8/25)x+142 μm, wherein x is the pitch of the second contact pads in micrometers.

Title
Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads
Application Number
12/750946
Publication Number
8183696 (B2)
Application Date
March 31, 2010
Publication Date
May 22, 2012
Inventor
Recai Sezi
Roettenbach
DE
Reinhard Hess
Straubing
DE
Gerald Ofner
Regensburg
DE
Rainer Leuschner
Regensburg
DE
Thorsten Meyer
Regensburg
DE
Agent
Slater & Matsil L
Assignee
Infineon Technologies
DE
IPC
H01L 21/98
H01L 23/488
H01L 21/78
H01L 23/48
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