08183677 is referenced by 16 patents and cites 32 patents.

A device including a semiconductor chip. One embodiment provides a device, including a metal layer having a first layer face. A semiconductor chip includes a first chip face. The semiconductor chip is electrically coupled to and placed over the metal layer with the first chip face facing the first layer face. An encapsulation material covers the first layer face and the semiconductor chip. At least one through-hole extends from the first layer face through the encapsulation material. The at least one through-hole is accessible from outside the device.

Title
Device including a semiconductor chip
Application Number
12/324420
Publication Number
8183677 (B2)
Application Date
November 26, 2008
Publication Date
May 22, 2012
Inventor
Georg Meyer Berg
Munich
DE
Agent
Dicke Billig & Czaja PLLC
Assignee
Infineon Technologies
DE
IPC
H01L 23/02
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