08174105 is referenced by 25 patents and cites 136 patents.

A stacked semiconductor package includes a substrate and a plurality of semiconductor dice stacked on the substrate. Each semiconductor die includes a recess, and a discrete component contained in the recess encapsulated in a die attach polymer. The stacked semiconductor package also includes interconnects electrically connecting the semiconductor dice and discrete components, and an encapsulant encapsulating the dice and the interconnects.

Title
Stacked semiconductor package having discrete components
Application Number
13/110275
Publication Number
8174105 (B2)
Application Date
May 18, 2011
Publication Date
May 8, 2012
Inventor
Chia Yong Poo
Singapore
SG
Chua Swee Kwang
Singapore
SG
Agent
Stephen A Gratton
Assignee
Micron Technology
ID, US
IPC
H01L 23/02
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