08093697 is referenced by 80 patents and cites 112 patents.

A method of making a microelectronic assembly includes providing a microelectronic package having a substrate, a microelectronic element overlying the substrate and at least two conductive elements projecting from a surface of the substrate, the at least two conductive elements having surfaces remote from the surface of the substrate. The method includes compressing the at least two conductive elements so that the remote surfaces thereof lie in a common plane, and after the compressing step, providing an encapsulant material around the at least two conductive elements for supporting the microelectronic package and so that the remote surfaces of the at least two conductive elements remain accessible at an exterior surface of the encapsulant material.

Title
Microelectronic packages and methods therefor
Application Number
12/769930
Publication Number
8093697 (B2)
Application Date
April 29, 2010
Publication Date
January 10, 2012
Inventor
Ellis Chau
San Jose
CA, US
Ilyas Mohammed
Santa Clara
CA, US
Teck Gyu Kang
San Jose
CA, US
Belgacem Haba
Saratoga
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H01L 23/02
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