08071424 is referenced by 18 patents and cites 33 patents.

Substrates having molded dielectric layers and methods of fabricating such substrates are disclosed. The substrates may advantageously be used in microelectronic assemblies having high routing density.

Title
Substrate for a microelectronic package and method of fabricating thereof
Application Number
12/830690
Publication Number
8071424 (B2)
Application Date
July 6, 2010
Publication Date
December 6, 2011
Inventor
Apolinar Alvarez Jr
Fremont
CA, US
Craig S Mitchell
San Jose
CA, US
Belgacem Haba
Saratoga
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H01L 21/56
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