Substrate for a microelectronic package and method of fabricating thereof United States Patent 08071424

08071424 is referenced by 18 patents and cites 33 patents.

Belgacem Haba Belgacem (Bel) Haba

Substrates having molded dielectric layers and methods of fabricating such substrates are disclosed. The substrates may advantageously be used in microelectronic assemblies having high routing density.

Title
Substrate for a microelectronic package and method of fabricating thereof
Application Number
12/830690
Publication Number
8071424 (B2)
Application Date
July 6, 2010
Publication Date
December 6, 2011
Inventor
Apolinar Alvarez Jr
Fremont
CA, US
Craig S Mitchell
San Jose
CA, US
Belgacem Haba
Saratoga
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H01L 21/56
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Citations: 18 (view full list)

  1. Rajesh Katkar, Guilian Gao, Charles G Woychik, Wael Zohni: Bond via array for thermal conductivity. Invensas Corporation, August 15, 2017: US09735084 (8 worldwide citation)
  2. Abiola Awujoola, Zhuowen Sun, Wael Zohni, Ashok S Prabhu, Willmar Subido: Wire bond wires for interference shielding. Invensas Corporation, November 7, 2017: US09812402 (2 worldwide citation)
  3. Abiola Awujoola, Zhuowen Sun, Wael Zohni, Ashok S Prabhu, Willmar Subido: Wire bond wires for interference shielding. Invensas Corporation, November 8, 2016: US09490222 (2 worldwide citation)
  4. Rajesh Katkar, Tu Tam Vu, Bongsub Lee, Kyong Mo Bang, Xuan Li, Long Huynh, Gabriel Z Guevara, Akash Agrawal, Willmar Subido, Laura Wills Mirkarimi: Wafer-level packaging using wire bond wires in place of a redistribution layer. Invensas Corporation, June 26, 2018: US10008469 (1 worldwide citation)
  5. Ashok S Prabhu, Rajesh Katkar: ‘RDL-First’ packaged microelectronic device for a package-on-package device. Invensas Corporation, March 6, 2018: US09911718 (1 worldwide citation)
  6. Belgacem Haba: Stackable molded microelectronic packages. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 13, 2018: US10128216
  7. Cyprian Emeka Uzoh, Rajesh Katkar: Multiple bond via arrays of different wire heights on a same substrate. Invensas Corporation, July 17, 2018: US10026717
  8. Belgacem Haba, Richard Dewitt Crisp, Wael Zohni: Microelectronic element with bond elements to encapsulation surface. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, June 26, 2018: US10008477
  9. Ilyas Mohammed: Substrate-less stackable package with wire-bond interconnect. Invensas Corporation, January 1, 2019: US10170412
  10. Hiroaki Sato, Teck Gyu Kang, Belgacem Haba, Philip R Osborn, Wei Shun Wang, Ellis Chau, Ilyas Mohammed, Norihito Masuda, Kazuo Sakuma, Kiyoaki Hashimoto, Kurosawa Inetaro, Tomoyuki Kikuchi: Package-on-package assembly with wire bonds to encapsulation surface. Tessera, August 28, 2018: US10062661

References: 33 (view full list)

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