08062968 is referenced by 20 patents and cites 81 patents.

A capacitive interposer (caposer) is disposed inside an integrated circuit package between a die and an inside surface of the package. Conductive layers within the caposer constitute a bypass capacitor. In a through-hole caposer, micro-bumps on the die pass through through-holes in the caposer and contact corresponding landing pads on the package. As they pass through the caposer, power and ground micro-bumps make contact with the plates of the bypass capacitor. In a via caposer, power and ground micro-bumps on the die are coupled to power and ground landing pads on the package as well as to the plates of the bypass capacitor by power and ground vias that extend through the caposer. In signal redistribution caposer, conductors within the caposer redistribute signals between die micro-bumps and package landing pads. In an impedance matching caposer, termination structures within the caposer provide impedance matching to a printed circuit board trace.

Title
Interposer for redistributing signals
Application Number
12/487855
Publication Number
8062968 (B1)
Application Date
June 19, 2009
Publication Date
November 22, 2011
Inventor
Robert O Conn
Laupahoehoe
HI, US
Agent
John J King
Lester Wallace
Assignee
Xilinx
CA, US
IPC
H01L 21/00
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