08048766 is referenced by 30 patents and cites 324 patents.

A method of fabricating a die containing an integrated circuit, including active components and passive components, includes producing a first substrate containing at least one active component of active components and a second substrate containing critical components of the passive components, such as perovskites or MEMS, and bonding the two substrates by a layer transfer. The method provides an improved monolithic integration of devices such as MEMS with transistors.

Title
Integrated circuit on high performance chip
Application Number
10/561299
Publication Number
8048766 (B2)
Application Date
June 23, 2004
Publication Date
November 1, 2011
Inventor
Guy Parat
Claix
FR
Laurent Ulmer
Grenoble
FR
Jean Pierre Joly
Saint-Egreve
FR
Agent
Brinks Hofer Gilson & Lione
Assignee
Commissariat a l Energie Atomique
FR
IPC
H01L 21/02
H01L 27/08
H01L 29/06
H01L 21/46
H01L 21/30
View Original Source