08035213 is referenced by 72 patents and cites 287 patents.

A chip package structure and a method of manufacturing the same are provided. The chip package structure includes a package portion and a plurality of external conductors. The package portion includes a distribution layer, a chip, a plurality internal conductors and a sealant. The distribution layer has a first surface and a second surface, and the chip is disposed on the first surface. Each internal conductor has a first terminal and a second terminal. The first terminal is disposed on the first surface. The sealant is disposed on the first surface for covering the chip and partly encapsulating the internal conductors, so that the first terminal and the second terminal of each internal conductor are exposed from the sealant. The external conductors disposed on the second surface of the distribution layer of the package portion are electrically connected to the internal conductors.

Title
Chip package structure and method of manufacturing the same
Application Number
12/285268
Publication Number
8035213 (B2)
Application Date
October 1, 2008
Publication Date
October 11, 2011
Inventor
Yuan Ting Chang
Kaohsiung
TW
Shih Kuang Chen
Kaohsiung
TW
Chang Chi Lee
Kaohsiung
TW
Agent
Cooley
Assignee
Advanced Semiconductor Engineering
TW
IPC
H01L 21/48
H01L 23/12
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