08026611 is referenced by 3 patents and cites 22 patents.

A microelectronic assembly including a first and second microelectronic elements. Each of the microelectronic elements have oppositely-facing first and second surfaces and edges bounding the surfaces. The first microelectronic element is disposed on the second microelectronic element with the second surface of the first microelectronic element facing toward the first surface of the second microelectronic element. The first microelectronic element preferably extends beyond at least one edge of the second microelectronic element and the second microelectronic element preferably extends beyond at least one edge of the first microelectronic element.

Title
Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another
Application Number
11/291398
Publication Number
8026611 (B2)
Application Date
December 1, 2005
Publication Date
September 27, 2011
Inventor
Belgacem Haba
Saratoga
CA, US
Ilyas Mohammed
Santa Clara
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H01L 23/48
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