08022512 is referenced by 1 patents and cites 13 patents.

A no-lead electronic package including a heat spreader and method of manufacturing the same. This method includes the steps of selecting a matrix or mapped no-lead lead frame with die receiving area and leads for interconnect; positioning an integrated circuit device within the central aperture and electrically interconnecting the integrated circuit device to the leads; positioning a heat spreader in non-contact proximity to the integrated circuit device such that the integrated circuit device is disposed between the leads and the heat spreader; and encapsulating the integrated device and at least a portion of the heat spreader and leads in a molding resin.

Title
No lead package with heat spreader
Application Number
11/670650
Publication Number
8022512 (B2)
Application Date
February 2, 2007
Publication Date
September 20, 2011
Inventor
Anang Subagio
Batam Island
ID
Romarico Santos San Antonio
Batam Island
ID
Mary Jean Bajacan Ramos
Alessandrea
SG
Agent
Wiggin and Dana
Assignee
Unisem
MU
IPC
H01L 23/495
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