08018068 is referenced by 30 patents and cites 182 patents.

A semiconductor package including a top-surface metal layer for implementing circuit features provides improvements in top-surface interconnect density, more flexible routing and mounting of top surface semiconductor packages, dies and passive components or a conformal shield cap implementation. The metal layer interconnected with an internal substrate of the semiconductor package by blind vias laser-ablated through the encapsulation and filled with metal. The vias extend from the top surface to an internal package substrate or through the encapsulation to form bottom-side terminals. The metal layer may be formed by circuit patterns and/or terminals embedded within the encapsulation conformal to the top surface by laser-ablating channels in the top surface of the encapsulation and filling the channels with metal. A conformal coating may be applied to the top surface of the semiconductor package over the metal layer to prevent solder bridging to circuit patterns of the metal layer.

Title
Semiconductor package including a top-surface metal layer for implementing circuit features
Application Number
12/589839
Publication Number
8018068 (B1)
Application Date
October 28, 2009
Publication Date
September 13, 2011
Inventor
Ronald Patrick Huemoeller
Chandler
AZ, US
Christopher Marc Scanlan
Chandler
AZ, US
Agent
Serge J Hodgson
Gunnison McKay & Hodgson L
Assignee
Amkor Technology
AZ, US
IPC
H01L 23/495
H01L 23/28
H01L 29/40
H01L 23/48
H01L 23/52
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