07999379 cites 157 patents.

A microelectronic assembly includes a microelectronic element, such as a semiconductor wafer or semiconductor chip, having a first surface and contacts accessible at the first surface, and a compliant layer overlying the first surface of the microelectronic element, the compliant layer having openings in substantial alignment with the contacts of the microelectronic element. The assembly desirably includes conductive posts overlying the compliant layer and projecting away from the first surface of the microelectronic element, the conductive posts being electrically interconnected with the contacts of the microelectronic element by elongated, electrically conductive elements extending between the contacts and the conductive posts.

Title
Microelectronic assemblies having compliancy
Application Number
11/360230
Publication Number
7999379 (B2)
Application Date
February 23, 2006
Publication Date
August 16, 2011
Inventor
Belgacem Haba
Saratoga
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H01L 23/52
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