07989940 is referenced by 55 patents and cites 9 patents.

A multi-layer electronic package having polymeric tape layers, where at least one of the polymeric tape layers has a via, through hole, or aperture therein to pass wiring between the layers. This enables a balance of package size, adhesive thickness, chip access, inventory management, package width, JEDEC ball out, and die exposure. The polymeric tape layers have surface circuits (e.g., leads, pads, and wiring) located on the surface.

Title
System and method for increasing the number of IO-s on a ball grid package by wire bond stacking of same size packages through apertures
Application Number
11/14506
Publication Number
7989940 (B2)
Application Date
December 15, 2004
Publication Date
August 2, 2011
Inventor
Masud Beroz
San Jose
CA, US
Belgacem Haba
San Jose
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H01L 23/02
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