07972899 is referenced by 2 patents and cites 6 patents.

An apparatus for depositing a solid film onto a substrate from a reagent solution includes reservoirs of reagent solutions maintained at a sufficiently low temperature to inhibit homogeneous reactions within the reagent solutions. The chilled solutions are dispensed through showerheads, one at a time, onto a substrate. One of the showerheads includes a nebulizer so that the reagent solution is delivered as a fine mist, whereas the other showerhead delivers reagent as a flowing stream. A heater disposed beneath the substrate maintains the substrate at an elevated temperature at which the deposition of a desired solid phase from the reagent solutions may be initiated. Each reagent solution contains at least one metal and either S or Se, or both. At least one of the reagent solutions contains Cu. The apparatus and its associated method of use are particularly suited to forming films of Cu-containing compound semiconductors.

Title
Method for fabricating copper-containing ternary and quaternary chalcogenide thin films
Application Number
12/462146
Publication Number
7972899 (B2)
Application Date
July 30, 2009
Publication Date
July 5, 2011
Inventor
Isaiah O Oladeji
Gotha
FL, US
Agent
Robert J Lauf
Assignee
Sisom Thin Films
FL, US
IPC
H01L 21/06
H01L 21/16
H01L 21/00
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