07960827 is referenced by 47 patents and cites 178 patents.

A thermal via heat spreader package includes an electronic component having an active surface including a nonfunctional region. A package body encloses the electronic component, the package body comprising a principal surface. Thermal vias extend from the principal surface through at least a portion of the package body and towards the nonfunctional region. A heat spreader is thermally connected to the thermal vias. Heat generated by the electronic component is dissipated to the thermal vias and to the heat spreader. The density of the thermal vias is increased in a hotspot of the electronic component thus maximizing heat transfer from the hotspot. In this manner, optimal heat transfer from the electronic component is achieved.

Title
Thermal via heat spreader package and method
Application Number
12/421118
Publication Number
7960827 (B1)
Application Date
April 9, 2009
Publication Date
June 14, 2011
Inventor
Mahmoud Dreiza
Phoenix
AZ, US
Christopher M Scanlan
Hellerup
DK
Jeffrey A Miks
Chandler
AZ, US
August J Miller Jr
Queen Creek
AZ, US
Agent
Serge J Hodgson
Gunnison McKay & Hodgson L
Assignee
Amkor Technology
AZ, US
IPC
H01L 23/34
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