07939934 is referenced by 43 patents and cites 80 patents.

An assembly for testing microelectronic devices includes a microelectronic element having faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, at least some of the conductive posts being electrically interconnected with the microelectronic element. The assembly also includes a plurality of support elements disposed between the microelectronic element and the substrate for supporting the flexible substrate over the microelectronic element. At least some of the conductive posts are offset from the support elements.

Title
Microelectronic packages and methods therefor
Application Number
11/315466
Publication Number
7939934 (B2)
Application Date
December 22, 2005
Publication Date
May 10, 2011
Inventor
David Gibson
Lake Oswego
OR, US
Belgacem Haba
Saratoga
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H01L 23/14
H01L 23/48
View Original Source