07932612 cites 56 patents.

An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device having a semiconductor chip with electrodes, a stress-relieving layer prepared on the semiconductor chip, a wire formed across the electrodes and the stress-relieving layer, and solder balls formed on the wire over the stress-relieving layer; and a bare chip as a second semiconductor device to be electrically connected to the first semiconductor device.

Title
Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board
Application Number
12/543221
Publication Number
7932612 (B2)
Application Date
August 18, 2009
Publication Date
April 26, 2011
Inventor
Nobuaki Hashimoto
Suwa
JP
Agent
Oliff & Berridge
Assignee
Seiko Epson Corporation
JP
IPC
H01L 27/148
H01L 27/146
H01L 29/40
H01L 23/48
H01L 23/52
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