07923290 is referenced by 13 patents and cites 22 patents.

A method of manufacture of an integrated circuit packaging system includes: mounting an integrated circuit, having a device through via and a device interconnect, over a substrate with the device through via traversing the integrated circuit and the device interconnect attached to the device through via; attaching a conductive support over the substrate with the conductive support adjacent to the integrated circuit; providing a pre-formed interposer, having an interposer through via and a pre-attached interconnect, with the pre-attached interconnect attached to the interposer through via; mounting the pre-formed interposer over the integrated circuit and the conductive support with the pre-attached interconnect over the device through via; and forming an encapsulation over the substrate covering the integrated circuit, the conductive support, and partially covering the pre-formed interposer.

Title
Integrated circuit packaging system having dual sided connection and method of manufacture thereof
Application Number
12/413302
Publication Number
7923290 (B2)
Application Date
March 27, 2009
Publication Date
April 12, 2011
Inventor
YoungChul Kim
Yongin-si
KR
Soo San Park
Seoul
KR
Chan Hoon Ko
Ichon si
KR
Agent
Mikio Ishimaru
Assignee
Stats Chippac
SG
IPC
H01L 21/50
H01L 21/48
H01L 21/44
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