07902660 is referenced by 102 patents and cites 469 patents.

A substrate for a semiconductor device and a manufacturing thereof, and a semiconductor device using the same and a manufacturing method thereof are disclosed. For example, in the substrate according to the present invention, a core is eliminated, so that the substrate has a very thin thickness, as well, the length of electrically conductive patterns becomes shorter, whereby the electrical efficiency thereof is improved. Moreover, since a carrier having a stiffness of a predetermined strength is bonded on the substrate, it can prevent a warpage phenomenon during the manufacturing process of the semiconductor device. Furthermore, the carrier is removed from the substrate, whereby a solder ball fusing process or an electrical connecting process of the semiconductor die can be easily performed.

Title
Substrate for semiconductor device and manufacturing method thereof
Application Number
11/440548
Publication Number
7902660 (B1)
Application Date
May 24, 2006
Publication Date
March 8, 2011
Inventor
Dong Hee Kang
Gyeonggi-do
KR
Doo Hyun Park
Gyeonggi-do
KR
Kyu Won Lee
Seoul
KR
Agent
Serge J Hodgson
Gunnison McKay & Hodgson L
Assignee
Amkor Technology
AZ, US
IPC
H01L 23/04
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