07865070 is referenced by 52 patents and cites 4 patents.

To prevent both slips caused by damage from projections, and slips caused by adhesive force occurring due to excessive smoothing. The heat treating apparatus includes a processing chamber for heat treating wafers and a boat for supporting the wafers in the processing chamber. The boat further includes a wafer holder in contact with the wafer and a main body for supporting the wafer holder. The wafer holder diameter is 63 to 73 percent of the wafer diameter, and the surface roughness Ra of the portion of the wafer holder in contact with the wafer is set from 1 μm to 1,000 μm. The wafer can be supported so that the amount of wafer displacement is minimal and both slips due to damage from projections on the wafer holder surface, and slips due to the adhesive force occurring because of excessive smoothing can be prevented in that state.

Title
Heat treating apparatus
Application Number
11/578963
Publication Number
7865070 (B2)
Application Date
March 22, 2005
Publication Date
January 4, 2011
Inventor
Sadao Nakashima
Toyama
JP
Naoto Nakamura
Toyama
JP
Iwao Nakamura
Toyama
JP
Agent
Kratz Quintos & Hanson
Assignee
Hitachi Kokusai Electric
JP
IPC
A21B 2/00
View Original Source